Tag Archives: transient electronics

Under Zero Trust: the U.S. Chip Resurgence

The Defense Advanced Research Projects Agency launched its Electronic Resurgence Initiative (ERI)  to help reboot a domestic chip industry that has been moving steadily offshore for decades…. Program officials and chip industry executives foresee the emergence of a “5th generation of computing” based on current cloud infrastructure while combining AI, the Internet of Things (IoT) and 5G wireless networks to deliver big data.

“The U.S. microelectronics industry is at an inflection point,” Ellen Lord, undersecretary of defense for acquisition and sustainment, told the virtual ERI summit. After decades of offshoring of chip fabrication, packaging and testing capabilities, “How do we reverse this trend?”  The Defense Department is expanding its technology base efforts by implementing a “step-by-step process for reconstituting the microelectronics supply chain,” focusing on various segments of the semiconductor ecosystem, including memory devices, logic, ICs and advanced packaging along with testing and assembly.

“While DoD does not drive the electronics market,” constituting only about 1 percent of demand, “we can drive significant R&D,” ERI is advancing public-private partnerships that provide a framework for commercial innovation. The result would be “pathfinder projects” geared toward a renewal of U.S. chip manufacturing. As trade frictions with China grow, ERI is placing greater focus on ensuring the pedigree of U.S. electronics supply chain. “We need to find a path to domestic sources,” said Lord.

While nurturing government-industry partnerships as part of an emerging next-generation U.S. industrial policy, this year’s DARPA summit also emphasized chip standards and processes for securing fabs, foundry services, devices and foundational microelectronics. In that vein, U.S. officials stressed new chips metrics like “quantifiable assurance” to secure dual-use devices that could end up in weapons or an IoT device.

“Our interests to protect both the confidentiality and the integrity of our supply chain are aligned with commercial interests, and we will continue to work across government and industry to develop and implement our quantitative assurance strategy based on zero trust,” said Nicole Petta, principal director of DoD’s microelectronics office. The “zero trust” approach assumes no device is safe, and that all microelectronics components must be validated before deployment. The framework marks a philosophical departure from DoD’s “trusted foundry” approach instituted in the 1990s, largely because “perimeter defenses” failed to account for insider threats…

DARPA Chip Efforts Pivots to Securing US Supply Chain, https://www.hpcwire.com, Aug. 24, 2020

Vanishing Electronics: Military

What are VANISHING PROGRAMMABLE RESOURCES (VAPR)?  From the DARPA website

What if these electronics simply disappeared when no longer needed? DARPA announces the Vanishing Programmable Resources (VAPR) program with the aim of revolutionizing the state of the art in transient electronics or electronics capable of dissolving into the environment around them. Transient electronics developed under VAPR should maintain the current functionality and ruggedness of conventional electronics, but, when triggered, be able to degrade partially or completely into their surroundings. Once triggered to dissolve, these electronics would be useless to any enemy who might come across them.

The Vanishing Programmable Resources (VAPR) program seeks electronic systems capable of physically disappearing in a controlled, triggerable manner. These transient electronics should have performance comparable to commercial-off-the-shelf electronics, but with limited device persistence that can be programmed, adjusted in real-time, triggered, and/or be sensitive to the deployment environment.  VAPR seeks to enable transient electronics as a deployable technology. To achieve this goal, researchers are pursuing new concepts and capabilities to enable the materials, components, integration, and manufacturing that will realize this new class of electronics.

Transient electronics may enable a number of revolutionary military capabilities including sensors for conventional indoor/outdoor environments, environmental monitoring over large areas, and simplified diagnosis, treatment, and health monitoring in the field. Large-area distributed networks of sensors that can decompose in the natural environment (ecoresorbable) may provide critical data for a specified duration, but no longer. Alternatively, devices that resorb into the body (bioresorbable) may aid in continuous health monitoring and treatment in the field.

Companies involved IBM: IBM plans is to utilize the property of strained glass substrates to shatter as the driving force to reduce attached CMOS chips into Si and SiO2 powder.

BAE Systems